Description
is a computer aided handling system (Manual Diebonder). It is open and flexible, comprising many
options for the manufacturing of microelectronics and microsystems
engineering. Key features and available options are: · Simplest, manually
operated, interactive visual interfaces · Free partitioning of work area
into connection and assembly fields. · Components are processable with
wafflepack, gelpack or customized carrier · Rear view camera for the
assembly of flip chip. · Support of an eutectic mounting station under inert
gas atmosphere, with full control of temperature and timing. · Adhesive,
solder or fluxing agent application, assisted by an extensive library
program of patterns, and achieved either by a freely mobile dispenser,
through punch from a squeegee, or by dipping into a dipping device.
→Product brochure for download (PDF)

- Easiest manual operation with dialogue windows on the screen
- Free organization of the 225 x 200 mm working area in pickup and placement areas
- Compact table unit for customer specific products
- Automatic production in case of fix pick and place positions
- Component presentation in waffle pack and GEL PAK
- open software architecture with various options
- basic system with modular hardware configuration
 |
AMADYNE GmbH
Industrielle Automatisierungstechnik
Draisstraße 11a
D-77815 Bühl
Phone: +49 7223 2818483 · Fax: +49 7223 2818485
| internet: |  | · | eMail: |  | VAT Nr.: DE813073000 · register of companies: Amtsgericht Mannheim HRB 211214
|